Program
Program
Plenary Speakers
Invited Speakers
Tutorial Sessions
ISPB 2018
Floor Plan
Date
Select
July 25 (Wed.)
July 26 (Thu.)
July 27 (Fri.)
July 28 (Sat.)
Place
ALL PLACE
Room A (#104~106)
Room B (#113)
Room C (#114)
Room D (#115)
Room E (#107~108)
Room F (#117~118)
Room Room C (#114)
TC2. Next Generation Plasma Etching
July 26 (Thu.)
13:20-15:00 ~
[TC2-1]
13:20-13:50 ~
Room C (#114)
[Invited] Some Aspects of Process Development in Plasma Etching
Nam Hun Kim (Adaptive Plasma Tech. Corp., Korea)
[TC2-2]
13:50-14:10 ~
Room C (#114)
Development of the Virtual Metrology Using a Plasma Information Variable (PI-VM) for Monitoring SiO2 Etch Depth
Yunchang Jang, Hyun-Joon Roh, Sangwon Ryu, Ji-Won Kwon, and Gon-Ho Kim (Seoul Nat`l Univ., Korea)
[TC2-4]
14:30-15:00 ~
Room C (#114)
[Invited] Plasma and Feature Scale Models for Etching of High Aspect Ratio Silicon Structures in Pulsed Inductively Coupled Plasmas
Jason Kenney, Jun-Chieh Wang, Wei Tian, Shahid Rauf, Samaneh Sadighi, Phillip Stout, Vinay Vidyarthi, Janny Guo, Kenneth Delfin, and Nicole Lundy (Applied Materials, Inc., USA)
Type
Authors
Session Title
Paper Title
