Date
Place
- Room C (#114)
- TC2. Next Generation Plasma Etching
- July 26 (Thu.)
- 13:20-15:00 ~
- [TC2-4]
- 14:30-15:00 ~
- Title:[Invited] Plasma and Feature Scale Models for Etching of High Aspect Ratio Silicon Structures in Pulsed Inductively Coupled Plasmas
- Jason Kenney, Jun-Chieh Wang, Wei Tian, Shahid Rauf, Samaneh Sadighi, Phillip Stout, Vinay Vidyarthi, Janny Guo, Kenneth Delfin, and Nicole Lundy (Applied Materials, Inc., USA)
Abstract Download
