Program
Program
Plenary Speakers
Invited Speakers
Tutorial Sessions
ISPB 2018
Floor Plan
Date
Select
July 25 (Wed.)
July 26 (Thu.)
July 27 (Fri.)
July 28 (Sat.)
Place
ALL PLACE
Room A (#104~106)
Room B (#113)
Room C (#114)
Room D (#115)
Room E (#107~108)
Room F (#117~118)
Room Room A (#104~106)
TA1. Sputtering Technologies
July 26 (Thu.)
09:00-10:30 ~
[TA1-1]
09:00-09:30 ~
Room A (#104~106)
[Invited] PIC-MC Simulation Study of Rotational Magnetron Sputtering
Andreas Pflug, Michael Siemers, Thomas Melzig, and Michael Vergohl (Fraunhofer Inst. for Surface Engineering and Thin Films IST, Germany)
[TA1-2]
09:30-10:00 ~
Room A (#104~106)
[Invited] ECR Plasma Enhanced Sputtering and Applications
Seong Bong Kim
1
, Seungil Park
1
, Changho Yi
1
, Wan-woo Park
2
, Jeong-rak Lee
2
, Jae-chul Do
2
, Woo-jin Choi
2
, and Sung Haeng Cho3 (
1
NFRI, Korea,
2
AVACO Co., LTD., Korea,
3
Electronics and Telecommunications Research Inst., Korea)
[TA1-3]
10:00-10:30 ~
Room A (#104~106)
[Invited] Effect of Interface on the Structure and Ferro-Electric Property of Y-Doped HfO2 Thin Films Prepared by Reactive Magnetron Co-Sputtering
Jun Xu
1
, Yu Zhang
1
, Da-Yu Zhou
1
, Wen-Qi Lu
1
, Hang-Hang Wang
1
, and Chi Kyu Choi2 (
1
Dalian Univ. of Tech., China,
2
Jeju Nat`l Univ., Korea)
Type
Authors
Session Title
Paper Title