Date
Place
- Room A (#104~106)
- TA1. Sputtering Technologies
- July 26 (Thu.)
- 09:00-10:30 ~
- [TA1-2]
- 09:30-10:00 ~
- Title:[Invited] ECR Plasma Enhanced Sputtering and Applications
- Seong Bong Kim1, Seungil Park1, Changho Yi1, Wan-woo Park2, Jeong-rak Lee2, Jae-chul Do2, Woo-jin Choi2, and Sung Haeng Cho3 (1NFRI, Korea, 2AVACO Co., LTD., Korea, 3Electronics and Telecommunications Research Inst., Korea)
Abstract Download
