Program
Program
Plenary Speakers
Invited Speakers
Tutorial Sessions
ISPB 2018
Floor Plan
Date
Select
July 25 (Wed.)
July 26 (Thu.)
July 27 (Fri.)
July 28 (Sat.)
Place
ALL PLACE
Room A (#104~106)
Room B (#113)
Room C (#114)
Room D (#115)
Room E (#107~108)
Room F (#117~118)
Room Room C (#114)
FC1. Plasma & Atomic Layer Etching
July 27 (Fri.)
09:10-10:40 ~
[FC1-1]
09:10-09:50 ~
Room C (#114)
[Keynote] Challenges to the Next Generation Semiconductor Equipment by Using Plasma
Kuntack Lee (Samsung Electronics Co., Ltd., Korea)
[FC1-2]
09:50-10:10 ~
Room C (#114)
Plasma-Assisted Atomic Layer Etching of Si-Based Dielectric Films Studied Using in Situ Surface Diagnostics
Sumit Agarwal
1
, Ryan J. Gasvoda
1
, Scott Wang
2
, Ranadeep Bhowmick
2
, and Eric A. Hudson2 (
1
Colorado School of Mines, USA,
2
Lam Research Corporation, USA.)
[FC1-3]
10:10-10:40 ~
Room C (#114)
[Invited] Frontiers of Industrial Application of Atomic Layer Etching
Alok Ranjan1 and Peter Ventzek2 (
1
TEL Tech. Center, America, USA,
2
Tokyo Electron America, Inc., USA)
Type
Authors
Session Title
Paper Title
