Program
Program
Plenary Speakers
Invited Speakers
Tutorial Sessions
ISPB 2018
Floor Plan
Date
Select
July 25 (Wed.)
July 26 (Thu.)
July 27 (Fri.)
July 28 (Sat.)
Place
ALL PLACE
Room A (#104~106)
Room B (#113)
Room C (#114)
Room D (#115)
Room E (#107~108)
Room F (#117~118)
Room Room C (#114)
TC3. Next Generation Plasma Etching
July 26 (Thu.)
15:30-17:00 ~
[TC3-1]
15:30-16:00 ~
Room C (#114)
[Invited] Etching of Semiconductor Devices
Thorsten Lill, Vahid Vahedi, and Richard A. Gottscho (Lam Research Corp., USA)
[TC3-2]
16:00-16:30 ~
Room C (#114)
[Invited] Methods to Enable Plasma Etching of Transition Metals with Atomic Scale Precision
Eric A Joseph, Hiroyuki Miyazoe, Nathan Marchack, John M. Papalia, Robert Bruce, and Sebastian U. Engelmann (IBM Thomas J. Watson Research Center, USA)
[TC3-3]
16:30-17:00 ~
Room C (#114)
[Invited] Absolute Electron Density Measurements for Manufacturing-Worthy Equipment and Processes
Albert Ellingboe (Dublin City Univ., Ireland)
Type
Authors
Session Title
Paper Title
