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Program

Date
Place
  • Room F (#117~118)
  • TP. Poster Session
  • July 26 (Thu.)
  • 17:30-19:00 ~
  • [TP-028]
  • 17:30-19:00 ~
  • Title:Co Liner for Enhancement of Cu Damascene Interconnections
  • Byeonghwa Jeong1, Yongseok Jang1, Eungjoon Lee1, Masamichi Harada2, Yutaka Kokaze2, and Geunyoung Yeom3 (1ULVAC KOREA, Ltd, Korea, 2ULVAC, Inc., Japan, 3Sungkyunkwan Univ., Korea)

  • Abstract Download